Related Experiment Video
Updated: Jan 10, 2026

Environmental Dynamic Mechanical Analysis to Predict the Softening Behavior of Neural Implants
Published on: March 1, 2019
Articular neural bioelectronics by decoupling mechanical strain from electron transport
Tong Li1,2, Fei Jin2, Lisha Hua2,3
1School of Chemistry and Chemical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China.
Abstract:
Implantable bioelectronics for dynamic articular nerves require interfaces that harmonize extreme mechanical compliance at extreme strains exceeding 120%, stable conductivity, and metabolic permeability-a triad unattained by current stretchable devices. Here, we introduce liquid metal-based ultraelastic fibrous bioelectronics for articular nerves that overcome interfacial and mechanical limitations through molecular engineering and structural design. Thiol-functionalized self-assembled monolayers on liquid metal nanoparticles enhance interfacial adhesion with neural tissues, eliminating fibrous encapsulation, while anisotropic silver nanowire networks decouple mechanical strain from electron transport, achieving negligible resistance variation under 150% repetitive strain. The porous mesh structure enables fluid permeability five orders of magnitude higher than conventional materials, ensuring physiological nutrient exchange in synovial joints. In vivo integration with rat ulnar nerves demonstrated chronic neuromodulation over 6 weeks without disruption of functional behavior. This work redefines biomechanically adaptive neuroelectronics, offering a universal framework for interfacing dynamic biological systems, from prosthetic sensory feedback to treating neurodegenerative pathologies.

