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Temporal Extrapolation Generalization of Proper Orthogonal Decomposition (POD) and Radial Basis Function (RBF)
Wenjun Zhao1,2, Bo Zhang1
1School of Energy and Power Engineering, Dalian University of Technology, Dalian 116024, China.
A new reduced-order surrogate model combines proper orthogonal decomposition (POD) and radial basis function (RBF) neural networks for accurate transient temperature prediction in electronics. This method significantly cuts computational costs for thermal management.
Area of Science:
- Computational science and engineering
- Thermal analysis
- Machine learning applications
Background:
- Accurate transient temperature prediction is crucial for effective thermal management in electronic devices.
- Existing methods can be computationally expensive, limiting real-time applications.
- Electronic packages often involve complex thermal interactions from multiple heat sources.
Purpose of the Study:
- To develop an efficient and accurate reduced-order surrogate modeling approach for transient temperature fields.
- To enable robust temporal extrapolation beyond the training data horizon.
- To reduce the computational cost associated with thermal analysis in electronic systems.
Main Methods:
- Utilized proper orthogonal decomposition (POD) for dimensionality reduction.
- Employed radial basis function (RBF) neural networks for surrogate modeling.
- Mapped time-conditioned modal coefficients in a parameter-time space.
Main Results:
- The proposed POD-RBF surrogate model achieved high predictive accuracy with a global MRE below 3%.
- Demonstrated significant reductions in computational cost compared to traditional methods.
- Validated the approach using a multi-heat-source conduction model typical of electronic packages.
Conclusions:
- The POD-RBF surrogate modeling approach offers an efficient and accurate solution for transient temperature prediction.
- The method shows strong potential for real-time thermal monitoring and management in electronic systems.
- Robust temporal extrapolation capabilities enhance its applicability for dynamic thermal scenarios.
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