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Fast Thermal Resistance Distribution Analysis in High-Power VCSEL Array Module.

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High-power vertical-cavity surface-emitting lasers (VCSELs) face performance limits due to thermal resistance. This study rapidly identified packaging as the main bottleneck, accounting for 70% of total thermal resistance in VCSEL array modules.

Keywords:
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Area of Science:

  • Optoelectronics
  • Semiconductor Devices
  • Thermal Management

Background:

  • Vertical-cavity surface-emitting lasers (VCSELs) are crucial for various applications.
  • High thermal resistance significantly degrades the performance of high-power VCSEL array modules.
  • Identifying thermal bottlenecks is essential for improving VCSEL performance.

Purpose of the Study:

  • To rapidly analyze the thermal characteristics of an 808 nm VCSEL array module.
  • To pinpoint the packaging thermal resistance bottleneck in high-power VCSEL modules.
  • To achieve better performance by addressing identified thermal issues.

Main Methods:

  • Utilized electrical transient measurements for non-destructive thermal analysis.
  • Applied the structure function algorithm for rapid segmentation of thermal resistance components.
  • Employed spectroscopy for comparative verification of thermal resistance measurements.

Main Results:

  • Packaging thermal resistances constituted 70% of the total thermal resistance at 8 A loading current.
  • The submount and Rsolder2 were identified as primary contributors, accounting for 54% of total thermal resistance.
  • Electrical transient measurements and spectroscopy yielded comparable total thermal resistance values.

Conclusions:

  • Packaging is the critical bottleneck limiting high-power VCSEL array module performance.
  • The structure function algorithm provides a fast and accurate method for thermal resistance analysis.
  • This research offers insights for reducing thermal resistance and enhancing VCSEL module design.