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Simulation, Fabrication and Characterization of THz Metamaterial Absorbers

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Multiphysics Optical-Thermal and Mechanical Modeling of a CMOS-SOI-MEMS Infrared Sensor with Metasurface Absorber.

Moshe Avraham¹, Yael Nemirovsky¹

¹Electrical and Computer Engineering Department, Technion-Israel Institute of Technology, Haifa 3200003, Israel.

Sensors (Basel, Switzerland)

|November 27, 2025

Summary

This study introduces a multiphysics modeling framework for integrating Metasurface absorbers into thermal infrared (IR) sensors. The framework optimizes optical, thermal, and mechanical performance for scalable, low-cost IR imaging applications.

Keywords:

CMOS-SOI FDTD MEMS MIM infrared sensor metasurface absorber multiphysics modeling thermal FEA uncooled detector

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Area of Science:

Optoelectronics
Nanophotonics
Microelectromechanical Systems (MEMS)

Background:

Infrared (IR) thermal sensors on CMOS-SOI-MEMS platforms offer scalable, low-cost thermal imaging solutions.
Optimizing optical, thermal, and mechanical performance is crucial for these sensors.
Metasurface absorbers present an opportunity to enhance IR sensor efficiency.

Purpose of the Study:

To develop and present a multiphysics modeling framework for integrating Metasurface absorbers into Thermal CMOS-SOI-MEMS IR sensors.
To investigate the impact of Metasurface absorbers on sensor performance.
To provide a predictive tool for designing high-performance, uncooled IR sensors.

Main Methods:

Finite-Difference Time-Domain (FDTD) simulations for optical absorption analysis.
Thermal Finite Element Analysis (FEA) for thermal performance evaluation.
Analytical RC circuit modeling and mechanical modal/harmonic analyses for thermal dynamics and structural integrity.

Main Results:

Demonstrated near-unity absorption at targeted IR wavelengths (e.g., 4.26 µm, 10 µm) using Metasurface absorbers.
Achieved high thermal isolation and maximized temperature rise (ΔT), with quantified sensitivity of the thermal time constant to Metasurface mass.
Validated analytical RC model against 3D FEA for accurate thermal dynamics capture.
Verified structural integrity with natural frequencies exceeding 20 kHz.

Conclusions:

The developed multiphysics framework holistically quantifies trade-offs between optical efficiency, thermal responsivity, and mechanical stability.
This framework serves as a predictive tool for designing advanced, uncooled IR sensors compatible with CMOS fabrication processes.
Metasurface integration shows significant potential for enhancing the performance of thermal IR sensors.