Related Experiment Video
Updated: Jan 9, 2026

Indirect Fabrication of Lattice Metals with Thin Sections Using Centrifugal Casting
Published on: May 14, 2016
CALPHAD-guided interlayer design for crack-free additive manufacturing of copper C18150 - Inconel 625 bimetallic
Liyi Wang1, Luis Fernando Ladinos Pizano1, Michael A Klecka2
1Physical Metallurgy and Materials Design Laboratory, Department of Mechanical Engineering and Materials Science, University of Pittsburgh, Pittsburgh, PA, USA.
Abstract:
Additive manufacturing (AM) of bimetallic structures combining copper alloys and Ni-based superalloys is critical for extreme environmental applications. However, interface cracking during fabrication persists due to thermophysical property mismatches. By implementing a CALPHAD-based ICME framework (CALPHAD: Calculation of Phase Diagrams; ICME: Integrated Computational Materials Engineering), we decode nonequilibrium solidification and phase stability to predict cracking susceptibility. Liquid phase separation emerges as the dominant mechanism, altering solute redistribution and thermal stress accumulation - a previously underexplored factor in bimetallic systems. Experiments using wire arc additive manufacturing (WAAM) validate model prediction: crack-free interfaces between C18150 and In625 require intermediate layers with 65 wt.% In625. This composition mitigates cracking with the lowest cracking susceptibility coefficient (CSC). Importantly, we establish a quantitative correlation between phase separation and CSC, proposing a way to analyze systems exhibiting these microstructural features. This work uses ICME methodologies by linking thermochemical modeling to process optimization, offering new principles for designing defect-resistant bimetallic components in extreme environments such as rocket engine nozzles.
More Related Videos
09:12Production of Single Tracks of Ti-6Al-4V by Directed Energy Deposition to Determine the Layer Thickness for Multilayer Deposition
Published on: March 13, 2018
08:50Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management
Published on: September 2, 2015