Flexible-Rigid Bonding of Silicon Based Neural Interface for Deep Brain LFP Recording

Microfabricated silicon neural probes have become the dominant technology in the field of implantable brain-computer interfaces. Mechanical bonding, electroplating, template printing, flip-chip bonding, and welding are prevalent methods for electrode packaging in preparation; however, these techniques often present challenges such as complex processes, elevated temperatures, or increased electrode thickness. We proposed a novel flexible-rigid bonding method for the silicon based neural interface, which markedly reduced the bonding volume compared with the traditional board to board connector. It simplified the assembly process of silicon probes, increased the electrode integration density and facilitated the assembly of the probe and flexible cable. This approach enables the flexible implantation of silicon electrodes in deep brain regions for recording neural signals.