Neural Interface for ECoG Recording based on Low Temperature Flexible Bonding

Parylene is widely applied to protect and insulate biomedical devices. Bonding process of flexible Parylene neural interfaces with neural recording and stimulation systems remains a challenge in the field of bioelectronics. Anisotropic conductive film (ACF) bonding is one of the new bonding methods benefiting from its convenience and small volume, widely applied on the bonding of rigid substrates. However, Parylene is not resistant to the high temperature and high pressure that is required in ACF bonding. We proposed a fully flexible ACF bonding process here focused on the low temperature bonding condition for the thin Parylene film and flexible printed circuit (FPC) to realize multichannel and flexible interconnection. Electrochemical measurement in vitro and in vivo suggested the reliable electrical connection of the flexible low temperature bonding.