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Achieving Long-Term Stability of Ultraflexible OPVs under 1-Sun in Ambient Air Using a UV-Filtering Polyimide
Shinyoung Lee1, Lulu Sun2, Sunghoon Lee1
1RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.
ACS Applied Materials & Interfaces
|December 4, 2025
Summary
Ultraflexible organic photovoltaics (OPVs) show promise for electronics, but degrade under stress. A novel polyimide (PI) film acts as a substrate and UV filter, significantly improving device stability and durability.
Area of Science:
- Materials Science
- Organic Electronics
- Photovoltaics
Background:
- Ultraflexible organic photovoltaics (OPVs) offer potential for wearable electronics.
- OPVs face stability challenges due to photo- and mechanical stress, exacerbated by UV radiation.
- UV light degrades active materials and device layers, limiting operational lifetime.
Purpose of the Study:
- To enhance the operational stability and mechanical durability of ultraflexible organic photovoltaics.
- To develop a multifunctional polyimide (PI) film serving as both a substrate and UV filter.
- To investigate the protective effects of the PI film against UV-induced degradation.
Main Methods:
- Fabrication of a 3.6 μm-thick polyimide (PI) film with UV-filtering properties (cutoff ~380 nm).
- Encapsulation of ultraflexible OPVs using the PI film and parylene.
- Mechanical stress testing (4000 cyclic bends at 0.5 mm radius) and stability testing under 1-Sun ambient irradiation.
Main Results:
- The PI film provided exceptional mechanical durability, withstanding 4000 bends without performance loss.
- The PI film's UV-filtering capability prevented internal oxygen generation and protected the parylene encapsulation.
- Devices exhibited a T80 lifetime of 160 h (bent) and ~220 h (unbent), with degradation mainly in the top parylene layer.
Conclusions:
- The developed PI film effectively enhances the stability and durability of ultraflexible OPVs.
- The dual function of the PI film as a substrate and UV filter is critical for device longevity.
- This approach offers a viable solution for realizing robust and stable ultraflexible electronic devices.
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