Sticking to Green: Sustainable Solutions for Next-Generation Microelectronic Packaging with Plant-Derived and...

For the last 70 years, the demand for semiconductors has grown globally, as they are ubiquitous in technologies ranging from microprocessors and memory in computers and servers to sensors and communication systems in smartphones and automobiles. This ongoing expansion drives a relentless need for higher performances and greater reliability. However, it is imperative to shift to more environmentally sustainable manufacturing practices. Biobased adhesives, which have adapted to every ecological niche, are a promising alternative to petroleum-based packaging epoxy glues to drive the next generation of green semiconductor manufacturing. In this perspective, we describe the key requirements and conventional practices for measuring the performances of adhesives suitable for microelectronic packaging. We highlight two promising biosourced alternatives: biomass derived from plants and adhesives produced by bacteria. Plant-derived adhesives are described with a particular focus on how successfully they match the mechanical, thermal, and processing properties desirable for microelectronic applications. Bacterial adhesives, on the other hand, have yet to be explored as sustainable alternatives in this field. They represent an abundant niche of compounds with unique properties, and strong and versatile adhesion, offering unique opportunities for developing advanced packaging solutions. We discuss advanced characterization methods needed to evaluate the physical and chemical properties of biosourced materials across multiple length scales, guiding their eventual integration into high-performance, environmentally responsible packaging solutions. Finally, we assess the maturity, cost, and environmental footprint of these biobased alternatives to better gauge their potential for industrial deployment.