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Updated: Jan 9, 2026

The Frequency Domain Thermoreflectance Technique for Thermal Property Measurements
Published on: December 5, 2025
Pushing the Thermal Conductivity Limit by Decoupling Dual-Channel Phonon Transport in Crystals
Yu Wu1, Ying Chen2, Shuming Zeng3
1Advanced Thermal Management Technology and Functional Materials Laboratory, Ministry of Education Key Laboratory of NSLSCS, School of Energy and Mechanical Engineering, Nanjing Normal University, Nanjing 210023, P. R. China.
Abstract:
We propose a novel design principle for achieving ultralow thermal conductivity in crystalline materials via a "heavy-light and soft-stiff" structural motif. By combination of heavy and light atomic species with soft and stiff bonding networks, both particle-like (κp) and wave-like (κc) phonon transport channels are concurrently suppressed. First-principles calculations show that this architecture induces a hierarchical phonon spectrum: soft-bonded heavy atoms generate dense low-frequency modes that enhance scattering and reduce κp, while stiff-bonded light atoms produce sparse high-frequency optical branches that disrupt the coherence and lower κc. High-throughput screening identifies Tl4SiS4 (κp = 0.10, κc = 0.06 W/mK) and Tl4GeS4 (κp = 0.09, κc = 0.06 W/mK) as representative candidates with strongly suppressed transport in both channels. A minimal 1D triatomic chain model further demonstrates the generality of this mechanism, offering a new paradigm for phonon engineering beyond the conventional κp-κc trade-off.
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