Related Experiment Video
Updated: Jan 9, 2026

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics
Published on: August 28, 2018
DFT coupled with NEGF study of N-type MOSFET based on 2D Bi2C3semiconductor
Yongjun Huang1, Jialin Yang1, Weicong Sun1
1Key Laboratory of Advanced Display Materials and Devices, Ministry of Industry and Information Technology, College of Material Science and Engineering, Nanjing University of Science and Technology, Nanjing 210094, People's Republic of China.
Abstract:
As silicon-based FETs face scaling limits, two-dimensional (2D) material emerge as promising alternatives with potential to suppress short-channel effects and reduce power consumption. We present a comprehensive investigation of the novel 2D bismuth carbide (Bi2C3) semiconductor using first-principles density functional theory (DFT) calculations combined with non-equilibrium green's function (NEGF) quantum transport simulations. Electronic band structure calculations indicate that monolayer Bi2C3possesses a moderate direct bandgap, a sharp conduction band, and a low electron effective mass (0.48m0). Device simulations reveal outstanding performance: a Bi2C3FET with a 10 nm channel length achieves an ultra-high on-state current (Ion) of 2540μAμm-1while maintaining a high on/off current ratio (exceeding 104), satisfying the requirements of the international technology roadmap for semiconductors (ITRS) for high-performance (HP) applications. Furthermore, scaling the channel length down to 5 nm still yields device performance compliant with ITRS specifications. Crucially, devices across different channel lengths exhibit fast switching speeds, low power-delay (τ), power-delay product, and excellent energy-delay product, fully meeting the ITRS HP targets. This study, for the first time, systematically evaluates the application potential of Bi2C3in MOSFETs via DFT-NEGF. Its excellent comprehensive performance metrics demonstrate that monolayer Bi2C3is a highly competitive candidate channel material for future HP integrated circuits.
More Related Videos
08:43Effect of Bending on the Electrical Characteristics of Flexible Organic Single Crystal-based Field-effect Transistors
Published on: November 7, 2016
08:12Ohmic Contact Fabrication Using a Focused-ion Beam Technique and Electrical Characterization for Layer Semiconductor Nanostructures
Published on: December 5, 2015
Related Concept Videos
MOSFET
In an n-MOSFET, the structure includes n-type source and drain...
Biasing of FET
In an N-channel JFET, the structure consists of N-type material forming the channel on a P-type substrate, with the...
Characteristics of MOSFET
Various vital parameters influence their functionality, which is crucial for theory and electronics applications. First, channel dimensions, precisely length, and width, are pivotal. The size of these channels affects the transistor's ability to carry current and switching speeds; shorter channels typically enable...
MOSFET: Enhancement Mode
In their basic form, enhancement-mode MOSFETs are typically non-conductive when the gate-source voltage (Vgs) is zero. This default 'off' state means no...
Field Effect Transistor
MOSFET: Depletion Mode
The primary characteristic of depletion-mode MOSFETs is their ability to conduct current between the drain and source terminals without gate bias. This inherent conductivity...