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Precipitation-driven self-sintering for flexible electronics.

Tao Fu1, Tao Sun1, Yinfang Jiang2

  • 1Department of Oral and Maxillofacial Surgery, The Second Affiliated Hospital of Zhejiang University School of Medicine, School of Stomatology and Key Laboratory of Oral Biomedical Research of Zhejiang Province, Hangzhou 310000, Zhejiang, China.

Iscience
|December 9, 2025
PubMed
Summary
This summary is machine-generated.

A novel precipitation-driven self-sintering method creates highly conductive indium gallium (InGa3) films on flexible hydrogels at room temperature. This scalable technique advances low-temperature processing for flexible electronics without compromising performance.

Keywords:
Physicsapplied sciences

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electronics Engineering

Background:

  • Flexible electronics (FE) demand conductive materials that are processable at low temperatures while maintaining mechanical flexibility.
  • Current methods often require high-temperature annealing, limiting substrate compatibility and energy efficiency.

Purpose of the Study:

  • To develop a low-temperature, scalable fabrication method for conductive films on flexible substrates.
  • To enable the creation of high-performance flexible electronics using a novel self-sintering strategy.

Main Methods:

  • A solution-processable system using liquid metal (LM) of indium gallium (InGa3) was designed.
  • A precipitation-driven self-sintering (PDSS) strategy was employed for in situ microparticle formation and sintering.
  • The process was conducted under ambient conditions on flexible hydrogel substrates.

Main Results:

  • Highly conductive InGa3 films were successfully formed on flexible hydrogels.
  • The PDSS method enabled spontaneous, additive-free self-sintering of metal microparticles within the hydrogel matrix.
  • The resulting InGa3 films exhibited high conductivity, mechanical durability, and excellent adhesion without high-temperature annealing.

Conclusions:

  • The PDSS method offers a scalable, substrate-friendly, and energy-efficient route for fabricating flexible electronics.
  • This approach overcomes limitations of traditional high-temperature processing for conductive films.
  • The findings pave the way for next-generation flexible electronic devices.