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Deformation Behavior of Asymmetric Direct Laser Interference Patterning Structures on Hot-Dip Tinned Copper
Silas Schütz1, Sebastian Suarez1, Yannik Bautz1
1Department of Materials Science and Engineering, Saarland University, 66123 Saarbrücken, Germany.
Materials (Basel, Switzerland)
|December 11, 2025
Summary
This study explores how surface microstructures on hot-dip tinned copper affect mechanical contact. Tailored surface patterns and aging influence load capacity and deformation, crucial for electrical interface optimization.
Area of Science:
- Materials Science
- Surface Engineering
- Tribology
Background:
- Optimizing electrical and mechanical interfaces relies on understanding contact mechanics.
- Surface structuring significantly impacts the performance of these interfaces.
Purpose of the Study:
- Investigate the mechanical contact behavior of hot-dip tinned copper surfaces.
- Analyze the influence of Direct Laser Interference Patterning (DLIP) on surface properties.
Main Methods:
- Fabricated microstructures with varying periodicities and tilt angles on tinned copper.
- Characterized surfaces using confocal laser scanning microscopy.
- Performed indentation testing and employed finite element simulations for mechanical analysis.
Main Results:
- Surface periodicity, tilt angle, and aging significantly affect load-bearing capacity and deformation.
- Intermediate periodicities (7.5 µm) at 0° tilt showed highest plastic deformation susceptibility in as-received samples.
- Aged samples exhibited enhanced mechanical stability due to the formation of a harder Cu 6 Sn 5 surface layer.
Conclusions:
- Tailored surface morphology and material selection are critical for designing effective structured contact surfaces.
- Findings provide insights for optimizing electrical applications through controlled surface engineering.
- Understanding deformation behavior is key to improving the reliability of electrical contacts.
