Enhancing the Resolution Utilization for DIC Measurement of Slender Components Using Shear Imaging.

Area of Science:

• Mechanical Engineering
• Optical Measurement Techniques
• Materials Science

Background:

• Digital image correlation (DIC) is a key technique for full-field deformation measurement.
• Slender components often underutilize DIC's spatial resolution due to their high aspect ratio.
• Existing methods may require complex setups or additional cameras for high-resolution measurements.

Purpose of the Study:

• To propose a novel virtual multi-camera DIC method for enhanced resolution utilization in slender component measurement.
• To improve the cost-effectiveness and practicality of DIC systems in constrained environments.
• To enable high-resolution full-field morphology and deformation measurements of slender components.

Main Methods:

• Integration of a conventional dual-camera setup with two Michelson shear devices (MSDs).
• Each MSD splits the component's image, projecting segments onto the same sensor to enhance resolution.
• System calibration to establish extrinsic parameters for stitching 3D data from different regions.

Main Results:

• Successful experimental validation using translation and bending tests.
• Accurate full-field morphology and deformation measurements achieved.
• Sub-pixel level agreement demonstrated in overlapping measurement regions.

Conclusions:

• The proposed virtual multi-camera DIC method effectively enhances resolution utilization for slender components.
• This approach provides a practical and cost-effective solution for high-resolution DIC measurements.
• The method overcomes limitations of conventional DIC in measuring high-aspect-ratio structures.