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Updated: Jan 9, 2026

Fused Filament Fabrication FFF of Metal-Ceramic Components
Published on: January 11, 2019
Study of a Single Joint Between Two FDM-Printed PLA Filaments
Jaime Orellana-Barrasa1, Emilio Antón Carrasco-Otermín1, José Ygnacio Pastor1
1Centro de Investigación en Materiales Estructurales (CIME), Departamento Ciencia de Materiales, Universidad Politécnica de Madrid, 28040 Madrid, Spain.
Abstract:
Isolating the mechanical properties of an FDM joint by performing a direct tensile test on it is something that has yet to be achieved. Developing a methodology for isolating the properties of a single joint could help to inform simulations and achieve a better understanding of the mechanisms affecting the bond strength between FDM-printed materials. In this work, a cruciform single-joint test (CSJT) of a cross-shaped specimen and a fast mechanical clamping protocol are introduced to evaluate the apparent tensile strength and fracture mechanisms of a single FDM-printed joint between two PLA filaments. First, a discussion of different approaches for obtaining a fast, reproducible, and reliable test of the samples is presented. Then, nozzle temperature (180-215 °C) and bed temperature (30-120 °C) were systematically varied, producing a minimum of n = 12 samples per condition. Samples were classified after failure, depending on the fracture mechanism (type 1 = joint failure; type 2 = filament failure), and the apparent tensile strength (ATS) of the joint was computed from the tensile tests and optical micrographs. The detachment probability of the joints decreased sharply above 210 °C, while the ATS increased, approaching a plateau near ~50 MPa. The influence of bed temperature was smoother, with a stable decrease in the detachment ratio as the ATS increased, indicating that nozzle temperature is the main factor contributing to the joint strength. These results map a temperature-driven transition from joint-controlled to filament-controlled failure. The method proposed also provides a minimal-material, high-throughput route to quantify FDM interlayer bonding and inform process simulations. Additional tests are performed to contextualize the results presented.
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