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Multi-scale study of thermal conduction at metal/carbon nanotube interface: combining two-temperature model and
Huijin Li1,2, Zi-Lan Liu3, Shuai Liu1,2
1Information Science Academy of China Electronics Technology Group Cooperation, Beijing 100144, People's Republic of China.
Abstract:
Thermal transport across metal/nonmetal interfaces plays a key role in the heat dissipation of micro- and nano-electronic devices. In this work, we investigate the interfacial thermal conductance of horizontally aligned carbon nanotube (CNT)/metal interfaces, which are more representative of practical device configurations. By combining nonequilibrium molecular dynamics with a two-temperature framework, the phonon heat flux and temperature profiles at the atomic scale are obtained and then incorporated into a steady-state heat conduction model for metal/nonmetal systems to determine the interfacial thermal resistance. The methodology is validated using the Cu/Si interface and subsequently applied to Cu/CNT and Ti/CNT interfaces. The calculated interfacial thermal conductances show good agreement with available experimental data and reveal the effects of interfacial bonding and structure on heat transport.
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