Electrospinning of thermal interface materials

As electronic systems continue to evolve toward higher integration and power densities, the demand for efficient thermal interface materials (TIMs) grows increasingly urgent. Electrospinning has emerged as a versatile and scalable approach for fabricating TIMs with tunable nanofiber architectures and tailored interfacial properties. This review examines how electrospinning directly influences thermal transport through control over fiber morphology, filler dispersion, and interface engineering. By integrating multidimensional fillers and optimizing electrospinning parameters-such as electric field strength, solution rheology, and collector configuration-researchers have constructed continuous heat conduction pathways with enhanced phonon alignment and reduced interfacial resistance. Particular emphasis is placed on colloidal and molecular mechanisms, including solvent evaporation-induced alignment, hydrogen bonding, and phonon vibrational density of states (VDOS) matching, which critically govern interfacial thermal transport. Representative examples from polymer- and phase change material (PCM)-based systems demonstrate the ability of electrospinning to deliver high thermal conductivity, flexibility, and environmental robustness. This review provides a mechanistic framework and developmental roadmap for electrospun TIMs, bridging colloid and interface science with advanced thermal management technologies.