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Updated: Jan 8, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Single-mode VCSELs utilizing annular metal apertures for lateral confinement and on-chip beam shaping techniques
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To ensure high-beam-quality single-mode operation of vertical-cavity surface-emitting lasers across diverse temperatures, we propose a surface-microstructured device combining annular metal-dielectric multilayers and an on-chip optical microlens feedback cavity.This architecture effectively suppresses thermally induced mode hopping and side-mode degradation. Using a wafer-level integration process, Ti/Pt multilayers confine transverse modes, while a SiO2/Ti3O5 microlens enhances optical feedback. The device achieves a single-mode output of 4.1 mW at 0 °C (driven by 8.5 mA), with side-mode suppression ratios exceeding 25 dB across 0-80 °C and 40.6 dB at 40 °C (8 mA). This monolithic strategy ensures thermal stability without the use of external optics, reducing package volume compared with hybrid solutions.

