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Laser shock deformation measurement based on multi-channel dynamic shearography
This study introduces a real-time, high-precision method using spatial-carrier dual-directional shearography to monitor material deformation during laser shock peening (LSP). The technique enables accurate, dynamic strain measurement for advanced material analysis.
Area of Science:
- Optical Engineering
- Materials Science
- Non-Destructive Testing
Background:
- Laser shock peening (LSP) is a critical surface treatment process.
- Accurate monitoring of dynamic material deformation during LSP is essential for process optimization.
- Existing methods may lack the real-time, high-precision capabilities required for dynamic deformation analysis.
Purpose of the Study:
- To develop and validate a real-time, high-precision material deformation monitoring method.
- To investigate the dynamic deformation behavior of materials during laser shock peening (LSP).
- To enable decoupled control of spatial-carrier frequencies for enhanced measurement accuracy.
Main Methods:
- Implementation of spatial-carrier dual-directional shearography.
- Optimization of optical system design with a tri-aperture misaligned configuration.
- Utilizing windowed inverse Fourier transform for real-time phase map acquisition and strain measurement.
Main Results:
- Achieved synchronous measurement along orthogonal shear directions.
- Demonstrated decoupled control of constant spatial-carrier frequencies.
- Successfully enabled real-time, high-precision dynamic strain measurement during LSP.
Conclusions:
- The proposed spatial-carrier dual-directional shearography system offers a robust solution for real-time, high-precision dynamic deformation monitoring.
- The method is effective for investigating material behavior under dynamic loading conditions like LSP.
- The optimized optical design and frequency control ensure accurate and reliable strain measurements.
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