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Low-loss, large-bandwidth multi-tip edge coupler for heterogeneous chip integration with large-mode-field-diameter
Optics Express
|December 19, 2025
Summary
This study introduces a novel four-segment multi-tip edge coupler (FS-MTEC) for efficient integration of large mode-field-diameter (MFD) laser chips with silicon photonics. The FS-MTEC achieves low coupling loss and broad bandwidth, enhancing heterogeneous chip integration.
Area of Science:
- Photonics and Optical Engineering
- Materials Science and Engineering
- Semiconductor Device Physics
Background:
- Integrating wide-waveguide, large mode-field-diameter (MFD) laser gain chips with silicon photonic chips faces challenges due to high coupling losses.
- Existing edge couplers are often optimized for single-mode or small MFD devices, limiting their application for large MFD lasers.
Purpose of the Study:
- To propose and demonstrate a novel four-segment multi-tip edge coupler (FS-MTEC) for efficient heterogeneous integration of wide-waveguide, large-MFD laser chips with silicon-based photonic chips.
- To achieve high coupling efficiency and low loss for large MFD laser chips, overcoming current integration limitations.
Main Methods:
- Utilized a Si3N4-on-insulator (SINOI) platform for the FS-MTEC design.
- Employed a multi-tip array structure at the coupling end to tailor mode field distribution.
- Designed a three-segment tapered waveguide transition section to suppress modal perturbations and diffraction.
- Conducted three-dimensional finite-difference time-domain (3D-FDTD) simulations for optimization and performance analysis.
- Performed manufacturing tolerance and Monte Carlo analyses to assess device robustness.
Main Results:
- Achieved 95% mode overlap efficiency with laser gain chips (50 µm × 2.5 µm elliptical MFD).
- Simulated TE- and TM-mode coupling efficiencies of 88% and 92% respectively at 1550 nm.
- Resulting coupling losses of 0.56 dB (TE) and 0.40 dB (TM), comparable to single-mode couplers.
- Demonstrated ultrabroadband operation (<1 dB loss) from O-band to L-band.
- Exhibited high horizontal misalignment tolerance (±8.5 µm for ≤1 dB excess loss).
- Manufacturing tolerance and Monte Carlo analyses confirmed the device's robustness.
Conclusions:
- The proposed FS-MTEC effectively addresses high coupling losses in integrating wide-waveguide, large-MFD laser chips with silicon photonics.
- The device offers excellent coupling performance, ultrabroadband operation, and robustness, making it suitable for heterogeneous chip integration.
- This work presents a promising new strategy for advanced photonic chip integration, enabling broader applications of large MFD lasers.
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