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Updated: Jul 27, 2026

Influence of Hybrid Perovskite Fabrication Methods on Film Formation, Electronic Structure, and Solar Cell Performance
Published on: February 27, 2017
Thermal Crosslinking Dual-Anchor Self-Assembled Monolayers for Improved Interfacial Hole Transport and Perovskite
Yongyue Yu1,2, Liang Gao1, Chen Qiu1
1College of Materials, College of Chemistry and Chemical Engineering, Innovation Laboratory for Sciences, and Technologies of Energy Materials of Fujian Province (IKKEM), Xiamen University, Xiamen, Fujian, P. R. China.
Abstract:
Nickel oxide (NiOx) based hole-transport material (HTM) has been extensively used in inverted structured perovskite solar cells (PSCs) but suffers from interfacial energy mismatch and defect-driven recombination, thus lower power conversion efficiency (PCE). Herein, we have designed low-cost cross-linkable self-assembled monolayers (SAMs) including single-anchoring 4'-(bis(4-vinylphenyl)amino)-[1,1'-biphenyl]-4-carboxylic acid (p-TPA) and dual-anchoring 4'-(bis(4-vinylphenyl)amino)-[1,1'-biphenyl]-3,5-dicarboxylic acid (m-TPA) to address these intrinsic issues. Results of theoretical calculations and experimental characterizations have shown that m-TPA modulation enhanced bidentate binding onto NiOx, leading to a favorable highest occupied molecular orbital (HOMO) and an optimized molecular geometry. The thermal cross-linked m-TPA demonstrated higher surface coverage, superior interfacial passivation on NiOx and an optimal Ni2⁺ fraction. The dual-anchor modified NiOx HTLs exhibited largely reduced perovskite permeation and higher surface electrical conductivity. Consequently, m-TPA-modified PSCs achieved a champion power conversion efficiency (PCE) of 24.16%, which is much higher than pristine NiOx-based (18.98%) and mono-anchor crosslinked modified ones (22.13%). The PSCs with cross-linked m-TPA modification also exhibited substantially reduced hysteresis and significantly improved device operational stability under environmental/irradiation stress. This work demonstrates the potential of thermal crosslinking SAMs with dual-anchor molecular engineering as an effective strategy to concurrently optimize charge extraction and interfacial resilience in PSCs.

