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Updated: May 9, 2026

Quasi-light Storage for Optical Data Packets
Published on: February 6, 2014
Ultra-wideband TFLN modulator with selectively removed slab based on multifunctional BCB platform for high coupling
Yutong He1, Hao Liu1, Changzheng Sun1
1Beijing National Research Center for Information Science and Technology (BNRist), State Key Laboratory of Space Network and Communications, Department of Electronic Engineering, Tsinghua University, Beijing 100084, China.
None:
Thin-film lithium niobate (TFLN) has a proven record of building high-performance electro-optic (EO) modulators. However, it has consistently posed challenges in securing low driving voltage, wide electro-optic bandwidth, low insertion loss, and high modulation efficiency simultaneously. Here, we demonstrate a telecom-wavelength EO modulator on the TFLN platform incorporating multifunctional benzocyclobutene (BCB) material. The low dielectric constant (low-k) BCB effectively reduces RF loss of the modulator and enables perfect velocity matching with a narrow electrode gap, thereby overcoming the conventional voltage-bandwidth trade-off. Meanwhile, in combination with a bilayer inversely tapered waveguide, it also facilitates the realization of high-efficiency edge couplers, significantly reducing the coupling loss of the modulator. In addition, the underlying TFLN slab is selectively removed to eliminate dielectric relaxation, ensuring a stable low-frequency EO response and bias-drift-free operation. The fabricated 13-mm-long modulator exhibits low half-wave voltages Vπ of 1.5 V in the C-band and 1.19 V in the O-band, corresponding to half-wave voltage-length products of 1.95 V·cm and 1.55 V·cm, respectively. Thanks to the BCB-clad edge coupler, an ultra-low coupling loss of 0.54 dB per facet is obtained. Ultra-wide EO bandwidths exceeding 110 GHz across the C + O-bands are demonstrated, and high-speed PAM8 data transmission with data rates up to 390 Gbit/s is successfully recorded in both C- and O-bands. The proposed modulator architecture not only delivers excellent overall performance, but also simplifies the fabrication process and expands the application potential.
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