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Updated: Jan 7, 2026

Author Spotlight: Real-Time Imaging of Bonding in 3D-Printed Layers
Published on: September 1, 2023
Zi'ang Han1,2, Zhenhu Jin1,2, Chenglong Zhang1
1State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing, China.
This study introduces a 3D bonding technique to double magnetic tunnel junction density in sensors without increasing chip size. This method effectively suppresses low-frequency noise, enhancing magnetic sensing capabilities for data-intensive applications.
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