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Updated: Jan 7, 2026

Characterization of Thermal Transport in One-dimensional Solid Materials
Published on: January 26, 2014
A Theoretical Solution for Analyzing Bi-Layer Structures with Differing Thermal Properties
Qianhua Peng1, Siyuan Zhou2, Yan Shi1
1State Key Laboratory of Mechanics and Control for Aerospace Structures, Nanjing University of Aeronautics & Astronautics, Nanjing 210016, China.
Abstract:
Based on the Hilbert-Riemann theory, this paper develops a simplified model to address interfacial fracture in bi-layer laminated solar cells with significantly dissimilar thermal properties. The model is used to analyze interfacial normal stress distributions and identify critical stress points, taking into account the substantial mismatch in the coefficients of thermal expansion between the semiconductor and encapsulation layers. The predicted temperature and stress fields are validated through finite element simulations. Furthermore, by investigating commonly used encapsulation films and solar cell modules, the coupled effects of the thermal expansion coefficient and elastic modulus are elucidated. The results demonstrate that, under a constant layer thickness, the position of the stress critical point is governed by two dimensionless parameters: the ratio of thermal expansion coefficients and the ratio of elastic moduli. This work offers an efficient and practical approach for predicting thermal stress concentration trends in laminated solar cell structures, thereby providing useful insights for the design and fabrication of solar modules.
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