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Large Scale Energy Efficient Sensor Network Routing Using a Quantum Processor Unit
Published on: September 8, 2023
Chuandong Chen1, Dishi Lin2, Qinghai Liu3
1School of Microelectronics, Fuzhou University, Fuzhou 350108, China.
We developed a new algorithm for fan-out wafer-level chip-scale packaging (WLCSP) redistribution layer (RDL) ordered routing. This method efficiently solves multi-capacity routing problems, outperforming traditional approaches.
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