Wettability-Controlled Hydrophobic Coating of CMP Component Using PTFE and DLC for Mitigating Slurry Agglomeration...

Area of Science:

• Materials Science
• Surface Engineering
• Semiconductor Manufacturing

Background:

• Chemical Mechanical Polishing (CMP) faces challenges including slurry agglomeration, scratches, and contamination.
• These issues degrade process reliability and device quality in semiconductor fabrication.
• Surface modification of CMP components is crucial for enhancing performance.

Purpose of the Study:

• To investigate the application of hydrophobic surface coatings on CMP components.
• To mitigate slurry-induced particle accumulation and scratches during CMP.
• To evaluate the effectiveness of Polytetrafluorothylene (PTFE) and diamond-like carbon (DLC) coatings.

Main Methods:

• PTFE deposited on stainless steel; DLC films coated on PEEK retainer rings.
• Hydrophobic performance evaluated using contact angle measurements and surface roughness analysis.
• 60-hour reliability tests under oxide CMP conditions using non-patterned wafers.

Main Results:

• PTFE-coated surfaces significantly reduced particle accumulation and scratches compared to uncoated substrates.
• PTFE provided stable hydrophobicity and effective scratch resistance.
• DLC exhibited superhydrophobic behavior (>160° contact angle), tunable via bonding ratios and roughness.

Conclusions:

• PTFE and DLC coatings enhance hydrophobicity, suppress slurry contamination, and improve scratch reliability.
• Surface modification of CMP hardware offers a practical route for process stability.
• Hydrophobic CMP components strengthen process stability and extend equipment lifetime in semiconductor manufacturing.