Investigation of Processing Conditions and Product Geometry in Out-Mold Decoration and Their Effects on Film Adhesion

Hui-Li Chen1, Po-Wei Huang2, Sheng-Hsun Hsu3

  • 1Mechanical Engineering, College of Semiconductor Engineering, CTBC University of Technology, Tainan 74448, Taiwan.

Polymers
|December 31, 2025
PubMed

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