Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Adjuvant targeted therapy in high-risk stage IB epidermal growth factor receptor-mutant lung cancer: Role of ground-glass opacity components.

JTCVS open·2026
Same author

Adjuvant chemotherapy for resected stage-ia lung adenocarcinoma with micropapillary histologic pattern.

Interdisciplinary cardiovascular and thoracic surgery·2026
Same author

Faecal microbiota transplantation and glucolipid metabolic disorders: the interventional role of gut microbiota.

Frontiers in endocrinology·2026
Same author

Low‑intensity aeration enhances algal-bacterial synergy to improve nitrogen removal from wastewater with low carbon-to-nitrogen ratio.

Bioresource technology·2026
Same author

Perioperative Outcomes of Robotic- vs Video-Assisted Thoracoscopic Surgery in Non-Small Cell Lung Cancer After Neoadjuvant Therapy.

The Annals of thoracic surgery·2025
Same author

Long-term progression-free survival with first-line pyrotinib monotherapy in a treatment-naïve stage IV NSCLC patient harboring an ERBB2 exon 20 insertion: a case report.

Frontiers in oncology·2025

Related Experiment Video

Updated: Jan 7, 2026

Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes
06:56

Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes

Published on: May 23, 2017

12.7K

Phase Measuring Deflectometry for Wafer Thin-Film Stress Mapping.

Yang Gao1, Xinjun Wan2,3, Kunying Hsin3

  • 1Jiangsu Key Laboratory of Engineering Mechanics, Southeast University, Nanjing 210096, China.

Sensors (Basel, Switzerland)
|December 31, 2025
PubMed
Summary

A new phase-measuring deflectometry (PMD) system offers full-field wafer stress mapping for semiconductor fabrication. This accurate and cost-effective method overcomes limitations of existing techniques for production-scale inspection.

Keywords:
PMDthin-film stresswafer

More Related Videos

Thin Film Composite Silicon Elastomers for Cell Culture and Skin Applications: Manufacturing and Characterization
08:02

Thin Film Composite Silicon Elastomers for Cell Culture and Skin Applications: Manufacturing and Characterization

Published on: July 3, 2018

11.0K
Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
11:14

Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope

Published on: May 28, 2016

14.3K

Related Experiment Videos

Last Updated: Jan 7, 2026

Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes
06:56

Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes

Published on: May 23, 2017

12.7K
Thin Film Composite Silicon Elastomers for Cell Culture and Skin Applications: Manufacturing and Characterization
08:02

Thin Film Composite Silicon Elastomers for Cell Culture and Skin Applications: Manufacturing and Characterization

Published on: July 3, 2018

11.0K
Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
11:14

Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope

Published on: May 28, 2016

14.3K

Area of Science:

  • Materials Science
  • Optical Engineering
  • Semiconductor Manufacturing

Background:

  • Wafer-level thin-film stress measurement is critical for semiconductor fabrication.
  • Current methods like interferometry and laser scanning have practical limitations (cost, data sparsity).
  • A need exists for a high-precision, full-field, and cost-effective stress measurement solution.

Purpose of the Study:

  • To develop and validate a phase-measuring deflectometry (PMD) system for full-field wafer stress mapping.
  • To address key challenges in adapting PMD for this application.
  • To provide an accurate and affordable alternative for production-scale thin-film stress inspection.

Main Methods:

  • Developed a PMD system incorporating refined screen positioning via inverse bundle adjustment.
  • Utilized a backward-propagation ray-tracing framework with a reprojection constraint strategy to resolve slope-height ambiguity.
  • Integrated regional wavefront reconstruction with Hermite interpolation to mitigate edge artifacts.

Main Results:

  • Achieved a peak-to-valley error of 0.48 µm for reconstructed topography on a spherical mirror.
  • Demonstrated curvature mapping on a 12-inch patterned wafer.
  • Validated stress measurements on an 8-inch bare wafer with <5% deviation from standard instrumentation.

Conclusions:

  • The proposed PMD system provides an accurate and cost-effective solution for wafer stress mapping.
  • The developed methods effectively address PMD implementation challenges.
  • The system is suitable for production-scale thin-film stress inspection in semiconductor fabrication.