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Related Concept Videos

Temperature Dependent Deformation01:12

Temperature Dependent Deformation

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In a nonhomogeneous rod made up of steel and brass, restrained at both ends and subjected to a temperature change, several steps are involved in calculating the stress and compressive load. Due to the problem's static indeterminacy, one end support is disconnected, allowing the rod to experience the temperature change freely. Next, an unknown force is applied at the free end, triggering deformations in the rod's steel and brass portions. These deformations are then calculated and added...
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San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
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Frequency-Domain Interpretation of PD Control01:24

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Proportional-Derivative (PD) controllers are widely used in fan control systems to improve stability and performance. A fan control system can be effectively represented using a Bode plot to illustrate the impact of a PD controller through its transfer function. The Bode plot visually conveys how PD control modifies the fan's response across various frequencies, providing a frequency domain interpretation of the controller's behavior.
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The maximum power flow for lossy transmission lines is derived using ABCD parameters in phasor form. These parameters create a matrix relationship between the sending-end and receiving-end voltages and currents, allowing the determination of the receiving-end current. This relationship facilitates calculating the complex power delivered to the receiving end, from which real and reactive power components are derived.
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General External Flow Characteristics01:26

General External Flow Characteristics

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The study of external flow is essential for creating structures and objects that interact efficiently and safely with moving fluids, such as air or water. When a body is immersed in a flowing fluid, it experiences two primary forces: drag, which opposes motion along the flow direction, and lift, which acts perpendicular to the flow. The shape, size, and orientation of the object influence these forces.Streamlined and Blunt Bodies in External FlowObjects in fluid flow are classified as...
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Fast Decoupled and DC Powerflow

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The fast decoupled power flow method addresses contingencies in power system operations, such as generator outages or transmission line failures. This method provides quick power flow solutions, essential for real-time system adjustments. Fast decoupled power flow algorithms simplify the Jacobian matrix by neglecting certain elements, leading to two sets of decoupled equations:
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  11. Die Shift Prediction Of Fan Out Panel Level Packages Considering Both Warpage And Flow Induced Mechanisms With Temperature Dependent Properties

Die shift prediction of fan out panel level packages considering both warpage and flow induced mechanisms with temperature dependent properties

Yu-Chi Sung1, Chih-Ping Hu1, Chun-Chieh Hung1

  • 1Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan.

Scientific Reports
|January 3, 2026

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View abstract on PubMed

Summary
This summary is machine-generated.

Die shift in fan-out packaging is a major challenge. This study reveals that heat release tape softening at high temperatures significantly worsens fluid-flow die shift, improving prediction accuracy.

Area of Science:

  • Semiconductor Manufacturing
  • Materials Science
  • Mechanical Engineering

Background:

  • Fan-out panel-level packaging is crucial for advanced semiconductors.
  • Die shift during compression molding impacts yield and reliability.
  • Understanding die shift mechanisms is essential for process optimization.

Purpose of the Study:

  • Investigate the mechanisms of die shift in fan-out packaging.
  • Quantify the impact of heat release tape's thermal softening on die shift.
  • Develop a validated multiphysics framework for die shift prediction.

Main Methods:

  • Material characterization of heat release tape (HRT).
  • Advanced finite element modeling (FEM) of compression molding.
  • Nanoindentation analysis to evaluate mechanical properties at elevated temperatures.
Keywords:
Compression moldingDie shiftFan-out panel-level packagingMold tape

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  • Integration of temperature-dependent HRT properties into simulations.

    • Main Results:

    • Young's modulus of HRT decreases significantly (2-3x) at high temperatures.
    • Temperature-dependent HRT properties substantially increase fluid-flow-induced die shift.
    • Simulations incorporating these properties improve experimental agreement by up to 48%.
    • Warpage effects dominate peripheral die shift; fluid-flow effects increase with die density.

    Conclusions:

    • Established a validated multiphysics framework for accurate die shift prediction.
    • Highlighted the critical role of temperature-dependent mechanical properties, especially HRT softening.
    • Provided insights into warpage- and fluid-flow-induced die shift mechanisms for improved semiconductor packaging.
    Nanoindentation
    Warpage