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Polymerizable Deep Eutectic Solvents-Enabled High-Lignin-Density Networks for Ambient Multi-Scale Fabrication of
Xinlong Li1, Na Luo1, Zhiyang Li1
1School of Materials Science and Engineering, Key Laboratory for Polymeric Composite and Functional Materials of Ministry of Education, Guangdong Functional Biomaterials Engineering Technology Research Center, Sun Yat-sen University, Guangzhou, P. R. China.
Researchers developed a novel polymerizable deep eutectic solvent (PDES) to incorporate high-density lignosulfonate (LS) into soft electronics. This breakthrough enhances performance and enables advanced applications in wearable sensors and bioelectronic interfaces.
Area of Science:
- Materials Science
- Polymer Chemistry
- Biomaterials Engineering
Background:
- Soft electronics utilizing biomass-derived materials, particularly lignin, are gaining attention.
- High lignin content often compromises material performance, limiting practical applications.
Purpose of the Study:
- To develop a high-lignin-density soft electronic material overcoming performance trade-offs.
- To create a versatile platform for advanced soft electronic devices.
Main Methods:
- Development of a polymerizable deep eutectic solvent (PDES) with quaternary ammonium monomer and lactic acid.
- Incorporation of high-density lignosulfonate (LS) (> 20 wt.%) into the PDES matrix.
- Utilizing lignin-induced self-catalytic polymerization and electrostatic assembly for rapid gelation and patterning.
Main Results:
- Achieved room temperature gelation (< 5 min) and ambient-air micropatterning.
- Enhanced mechanical strength (> 1 MPa) and adhesion (> 500 kPa) through non-covalent interactions.
- Demonstrated self-healing, photothermal, antibacterial properties, ion conduction (> 3 mS cm⁻¹), and wide operating temperature range (-80°C to 100°C).
- Successfully fabricated flexible supercapacitors and miniaturized soft organic electrochemical transistor (OECT) arrays.
Conclusions:
- The high-lignin-density eutectogel platform enables robust, multifunctional soft electronics.
- This approach facilitates the development of printed soft ionotronics, bioelectronic interfaces, and brain-inspired computing.
- The material exhibits excellent environmental adaptability and mechanical resilience for wearable applications.
