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Published on: May 17, 2024
Structural Heterogeneity in Medium-Entropy AgMnSbPbTe4 for Glassy Thermal Transport and High Thermoelectric
Yukun Liu1,2, Zhi Li1, Debattam Sarkar3
1Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States.
Abstract:
Medium-entropy semiconductors represent a unique category of entropy-engineered materials. They possess a considerable level of randomness in atomic mixing, although this is not sufficient to conclusively achieve single-phase structure stabilization, in contrast to high-entropy materials. This introduces strong competition between the formation of different phases, which can potentially lead to structural heterogeneity. In this work, we uncover endotaxial nanoprecipitates in the microscopically identified homogeneous medium-entropy semiconductor AgMnSbPbTe4. These nanoprecipitates initially crystallize in a cubic phase (Fm3̅m) within kinetically stabilized AgMnSbPbTe4, subsequently evolving into a thermodynamically stable monoclinic phase (P21/c) during thermal annealing while maintaining an endotaxial relationship with the matrix lattice. This nanophase segregation and the resultant lattice mismatch at interfaces introduce strain fluctuations up to 5% at intervals of 20 nm across the entire microstructure. Within the matrix phase, atomic displacement of up to 23 pm was observed. This structural heterogeneity results in glass-like thermal transport behavior, achieving an ultralow lattice thermal conductivity κL = 0.312 Wm-1 K-1 at 800 K, which is in accordance with the amorphous limit predicted by the Cahill model. The synergy of band convergence effect and well-maintained carrier mobility leads to a maximum ZT of 1.72 at 800 K and an average ZTavg of 1.02 over the temperature range of 300-825 K. This study highlights that the underexplored structural heterogeneity in medium-entropy semiconductors can potentially yield beneficial phenomena, such as the phonon-glass electron-crystal transport behavior in this case, which holds promise for advancing thermoelectric applications.
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