Unlocking Superior Mechanical Performance in Electrolytic Copper Foils Through Synergistic Competitive Additives

Area of Science:

• Materials Science
• Electrochemistry
• Surface Science

Background:

• Advancements in high-frequency electronics necessitate improved electrolytic copper foils with superior mechanical integrity and dimensional stability.
• Existing copper foils face limitations in meeting the stringent demands of next-generation electronic devices.
• The development of novel additive systems is crucial for enhancing copper foil performance.

Purpose of the Study:

• To investigate the effects of a dual-additive system, alcohol sulfur propanesulfonate (HP) and collagen, on the electrodeposition of copper.
• To systematically analyze the impact of these additives on Cu2+ ion electrodeposition behavior, copper microstructure, and mechanical characteristics.
• To provide theoretical insights and practical guidelines for fabricating advanced electrolytic copper foils.

Main Methods:

• Systematic investigation of Cu2+ ion electrodeposition using a dual-additive system (alcohol sulfur propanesulfonate and collagen).
• Analysis of copper microstructure and mechanical properties by varying additive concentrations.
• Characterization of crystalline structure, grain morphology, and twin boundary formation.

Main Results:

• Breakthrough improvements in mechanical properties: tensile strength increased by 1.96-fold (566 MPa) and elongation by 2.48-fold (9.11%).
• Significant increase in Σ3 twin boundaries from 32.3% to 73.5% due to additive synergy.
• Additive system demonstrated improved polarization behavior, crystalline structural transformations, and refined grain morphology.

Conclusions:

• The synergistic interaction between depolarizing (HP) and polarizing (collagen) additives effectively enhances copper foil mechanical properties.
• The dual-additive system promotes abundant twin crystal formation through controlled lattice growth and atomic misalignments.
• This research offers vital insights for tailoring copper foil microstructures for demanding electronic applications and advancing material fabrication.