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Anisotropic Thermal Conductivity in Pellet-Based 3D-Printed Polymer Structures for Advanced Heat Management in

Michal Rzepecki1, Andrzej Rybak1

  • 1ABB Corporate Technology Center, Starowislna 13A, 31-038 Krakow, Poland.

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Summary

This study demonstrates 3D printing of polymer composites with aligned mineral fillers for enhanced thermal conductivity. This breakthrough offers improved heat dissipation in electronic devices while maintaining electrical insulation.

Keywords:
additive manufacturinganisotropic propertiesfiller orientationpellet printingpolymer compositesthermal conductivitythermal management

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Area of Science:

  • Materials Science
  • Polymer Engineering
  • Additive Manufacturing

Background:

  • Efficient thermal management is crucial for high-power-density, miniaturized electrical and electronic devices.
  • Advanced heat dissipation solutions are needed to overcome current limitations.

Purpose of the Study:

  • Investigate anisotropic thermal conductivity in polymer structures fabricated using pellet-based fused granulate fabrication.
  • Control filler orientation to enhance heat dissipation in 3D-printed materials.

Main Methods:

  • Fabricated polyamide 6 composite samples with mineral fillers using pellet-based fused granulate fabrication.
  • Controlled printing path direction to orient flake-shaped fillers.
  • Measured thermal conductivity using a guarded heat flow meter and dielectric properties.

Main Results:

  • Achieved significant thermal anisotropy, with thermal conductivity of 4.09 W/m·K parallel to heat flow and 1.21 W/m·K perpendicular.
  • Demonstrated a 238% enhancement in thermal conductivity and an anisotropy ratio of 3.4.
  • Confirmed suitability for electrical insulation with low dielectric loss (<0.05 at 1 kHz).

Conclusions:

  • Pellet-based fused granular fabrication enables in situ control of filler orientation for tailored thermal properties.
  • Achieved unprecedented thermal anisotropy and high through-plane thermal conductivity in 3D-printed polymer structures.
  • Presents a breakthrough approach for advanced thermal management in electrical devices requiring electrical insulation.