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Analysis of metal-assisted chemical etching for microscale Si structures using Arrhenius method
Sunhae Choi1, Haekyun Bong1,2, Kyunghwan Kim3
1School of Integrated Technology, Yonsei University, Incheon 21983, Republic of Korea. jungwoo.oh@yonsei.ac.kr.
Physical Chemistry Chemical Physics : PCCP
|January 12, 2026
Summary
Metal-assisted chemical etching (MACE) efficiently fabricates silicon microstructures. This study reveals how temperature, metal thickness, and pattern geometry impact MACE kinetics, achieving a low activation energy for optimized 3D silicon fabrication.
Area of Science:
- Materials Science
- Nanotechnology
- Surface Chemistry
Background:
- Metal-assisted chemical etching (MACE) is a damage-free technique for creating high-aspect-ratio silicon microstructures.
- Understanding MACE's thermal activation and catalyst morphology is crucial for microfabrication but remains limited.
Purpose of the Study:
- To systematically investigate how etchant temperature, metal thickness, and pattern geometry influence MACE etching kinetics.
- To quantify the activation energy of MACE under varying catalyst conditions.
Main Methods:
- Fabrication of silicon microstructures using MACE.
- Systematic variation of etchant temperature, metal thickness, and pattern geometry.
- Analysis of etch depth data using Arrhenius plots to determine activation energies.
Main Results:
- Etchant temperature, metal thickness, and pattern geometry significantly affect MACE etching kinetics.
- Activation energy was found to be strongly dependent on metal coverage and thickness.
- Achieved a remarkably low activation energy of 20.02 kJ mol-1, significantly lower than conventional wet etching.
Conclusions:
- MACE exhibits significantly lower activation energy compared to conventional wet etching, demonstrating its efficiency.
- Catalyst morphology and thickness play a critical role in the thermal energy barrier of MACE.
- Provides quantitative insights into MACE mechanisms and practical guidance for optimizing 3D silicon microfabrication.

