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Bonding-site-locked interfacial engineering in NH2-MIL-125(Ti)/copper chlorophyllin S-scheme enabling spatially
Mingyu Heng1, Haotong Ma1, Zhanshuo Tao1
1School of Materials and Chemistry, University of Shanghai for Science and Technology, Shanghai 200093, China.
Abstract:
Interfacial electronic coupling critically determines the performance of S-scheme photocatalysts, yet spatial mismatching between anchoring sites and charge-accumulation regions often limits charge transfer efficiency. Herein, a bonding-site-locked interfacial engineering strategy is proposed to construct an S-scheme heterojunction between NH2-MIL-125(Ti) and sodium copper chlorophyllin (SCC), enabling spatially matched charge transfer pathways through ester linkages between Ti-OH and -COOH groups. The ester-linked composite (eNS) achieves a CO generation rate of 90.6 μmol g-1 h-1, which is 1.65 times higher than that of the amide-linked counterpart (aNS) and maintains over 80% activity after seven cycles under AM 1.5 G illumination without sacrificial agents. Comprehensive characterization and theoretical calculations reveal that ester linkage precisely anchors SCC at the Ti-OH electron-rich region, facilitating vectorial electron migration and enhancing CO2 adsorption/activation, whereas the non-site-specific amide linkage in aNS leads to inefficient charge transfer. This study highlights bonding-site-locked interfacial design as a general route to optimize spatial charge transfer and photocatalytic efficiency in MOF-organic hybrid systems.
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