You might also read
Articles linked to this work by shared authors, journal, and citation graph.
Updated: Jan 17, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Researchers developed flexible deep ultraviolet (DUV) vertical-cavity surface-emitting lasers (VCSELs) using AlGaN. This breakthrough enables advanced flexible photonic devices for smart light sources and integrated systems.
Area of Science:
Background:
Purpose of the Study:
Main Methods:
Main Results:
Conclusions: