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Published on: June 23, 2023
Design and Vision-Based Calibration of a Five-Axis Precision Dispensing Machine
Ruizhou Wang1, Jinyu Liao1, Binghao Wang1
1State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China.
This study introduces a vision-based measurement (VBM) system to identify geometric errors in five-axis precision dispensing machines. The system enables automated calibration, improving semiconductor packaging accuracy.
Area of Science:
- Mechanical Engineering
- Robotics
- Metrology
Background:
- Five-axis precision dispensing machines are crucial for semiconductor packaging.
- Geometric errors in these machines significantly impact dispensing accuracy.
- Existing calibration methods can be complex and time-consuming.
Purpose of the Study:
- To propose a vision-based measurement (VBM) system for identifying and calibrating geometric errors in five-axis dispensing machines.
- To develop an automated solution for kinematic calibration and workpiece detection.
- To enhance the overall accuracy and reliability of semiconductor packaging processes.
Main Methods:
- Established a kinematic model using screw theory's product-of-exponential formulation.
- Designed a geometric error identification algorithm incorporating position-independent geometric errors (PIGEs) and position-dependent geometric errors (PDGEs).
- Employed singular value decomposition and regularization to solve overdetermined equations and identify PIGEs in the A and C axes.
Main Results:
- The VBM system successfully identified eight PIGEs in the A and C axes.
- Measured mean spatial position error of 59.9 μm and mean orientation error of 160 arcsec for the end-effector.
- Verified the proposed approach through comprehensive error measurements.
Conclusions:
- The VBM system offers a feasible and automated calibration solution for five-axis precision dispensing machines.
- The developed method effectively quantifies geometric errors, crucial for high-precision applications.
- This approach contributes to improved accuracy in semiconductor packaging.
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