Subsurface Fracture Mapping in Adhesive Interfaces Using Terahertz Spectroscopy

Adhesive fracture in layered structures is governed by subsurface crack evolution that cannot be accessed using surface-based diagnostics. Methods such as digital image correlation and optical spectroscopy measure surface deformation but implicitly assume a straight and uniform crack front, an assumption that becomes invalid for interfacial fracture with wide crack openings and asymmetric propagation. In this work, terahertz time-domain spectroscopy (THz-TDS) is combined with double-cantilever beam testing to directly map subsurface crack-front geometry in opaque adhesive joints. A strontium titanate-doped epoxy is used to enhance dielectric contrast. Multilayer refractive index extraction, pulse deconvolution, and diffusion-based image enhancement are employed to separate overlapping terahertz echoes and reconstruct two-dimensional delay maps of interfacial separation. The measured crack geometry is coupled with load-displacement data and augmented beam theory to compute spatially averaged stresses and energy release rates. The measurements resolve crack openings down to approximately 100 μm and reveal pronounced width-wise non-uniform crack advance and crack-front curvature during stable growth. These observations demonstrate that surface-based crack-length measurements can either underpredict or overpredict fracture toughness depending on the measurement location. Fracture toughness values derived from width-averaged subsurface crack fronts agree with J-integral estimates obtained from surface digital image correlation. Signal-to-noise limitations near the crack tip define the primary resolution limit. The results establish THz-TDS as a quantitative tool for subsurface fracture mechanics and provide a framework for physically representative toughness measurements in layered and bonded structures.