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Updated: Jan 30, 2026

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
Published on: April 13, 2016
Radiation-tolerant atomic-layer-scale RF system for spaceborne communication
Liyuan Zhu1,2, Yang Yang3, Xiangqi Dong1
1State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Fudan University, Shanghai, China.
Abstract:
Integrated circuits for communications play an enabling role when it comes to outer-space exploration thanks to their small footprint and low weight1-3. However, owing to the severe irradiation effects of space energetic particles, the implementation of radiation-tolerant electronic circuits remains a challenge4-6. Here we report the observation of the space radiation effect on a satellite-based device and find that atomically thin materials are expected to accumulate minimal radiation-induced damage in principle. Accordingly, on the basis of a 4-inch wafer-scale monolayer 2D MoS2 process, we implement an atomic-layer transistor-based radiation-tolerant radio frequency (RF, 12-18 GHz) system with both transmitters and receivers for spaceborne communication. For on-orbit experiments, the 2D communication system was successfully launched to the approximately 517 km low Earth orbit. Notably, the system maintains a bit error rate (BER) of less than 10-8 in the transmitted data after 9 months of on-orbit operation, indicating substantial radiation tolerance and long stability. The lifespan of the 2D communication system is predicted to be about 271 years even on the geosynchronous orbit with a much harsher radiation environment. This work showcases the unique prospects of 2D electronics for spaceborne applications.
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