Related Experiment Video
Updated: Jan 31, 2026
05:45
Uncovering Hidden Dynamics of Natural Photonic Structures Using Holographic Imaging
Published on: March 31, 2022
3.1K
GHz dynamic holographic VCSEL chip via current-addressed modes multiplexing
Xiaonan Hu1,2, Yibo Dong1,2, Jianyang Shi3
1School of Artificial Intelligence Science and Technology, University of Shanghai for Science and Technology, Shanghai, China.
Nature Communications
|January 29, 2026
Summary
Researchers developed current-addressed holography in multimode vertical-cavity surface-emitting lasers (VCSELs). This technique uses orbital angular momentum (OAM) modes for faster, more compact 3D displays and holographic systems.
Area of Science:
- Optoelectronics
- Photonics
- Laser Engineering
Background:
- High-order spatial modes in vertical-cavity surface-emitting lasers (VCSELs) are typically suppressed to maintain beam quality.
- These modes, however, possess potential as independent information carriers.
Purpose of the Study:
- To develop a method for utilizing high-order spatial modes in VCSELs for enhanced information capacity.
- To enable dynamic reconfigurability in holographic systems through current-addressed mode multiplexing.
Main Methods:
- Current-addressed modes multiplexing holography was developed for multimode VCSELs.
- Monolithic integration of laser-nanoprinted multiplexed holograms with VCSEL chips was achieved.
- Orbital angular momentum (OAM) components were controlled via injection current.
Main Results:
- Demonstrated enhanced information channel capacity through injection current-dependent dominant OAM components.
- Achieved dynamic 3D display using a 2x2 VCSEL chip array with a unit area of ~100x100 μm².
- Reported an ultrahigh refresh rate of ~1.93 GHz, the fastest holographic switching speed for a chip-scale system to date.
Conclusions:
- Established a novel platform for miniaturized holographic optoelectronic systems.
- The technology enables dynamic light-field manipulation with unprecedented speed and compactness.
- Paves the way for portable/wearable devices, high-speed interconnects, and advanced virtual/augmented reality systems with reduced latency.
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