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Ascorbic Acid-Assisted Self-Assembly of 4-Aminothiophenol to Enhance Interfacial Adhesion between Copper and
Xindi Xu1, Chi Zhang2, Wei-Yi Zhang1
1Shanghai Key Laboratory of Molecular Catalysis and Innovative Materials, State Key Laboratory of Porous Materials for Separation and Conversion, iChEM (Collaborative Innovation Center of Chemistry for Energy Materials), Department of Chemistry, Fudan University, Shanghai 200438, China.
Abstract:
High-speed data transmission requires the formation of fine and smooth Cu wiring, which inevitably causes a decline of interfacial bonding strength between Cu and the insulating dielectric layer. In this work, 4-aminothiophenol (4-ATP) is used as a bifunctional promoter for the interfacial adhesion between a Cu foil and a widely used Ajinomoto build-up film (ABF) without coarsening the Cu surface. It is found that the introduction of ascorbic acid (AA) accelerates the self-assembly process of 4-ATP on Cu surface, as monitored by in situ attenuated total reflection surface-enhanced infrared absorption spectroscopy (ATR-SEIRAS) and examined by cyclic voltammetry (CV). Peel strength tests and morphology analyses reveal that the AA-assisted 4-ATP SAM significantly enhances the interfacial adhesion between Cu and ABF, which is of practical significance in advanced packaging.
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