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Updated: Feb 13, 2026

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
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Thermal management of 3-D heterogeneously integrated microelectronics: challenges and future research directions

Manoj Kumar Sharma1, Bladimir Ramos-Alvarado2

  • 1Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA, 16802, USA. 56mksharma@gmail.com.

Communications Engineering
|February 11, 2026
PubMed

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