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Preparation and Reactivity of Gasless Nanostructured Energetic Materials
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Experimental Study on Laser-Controlled Explosive Welding of Microscale Metallic Foils Driven by Energetic Materials
Xiaojun Ye1,2, Dongxian Ye1, Yanshu Fu2
1School of Information and Artificial Intelligence, Nanchang Institute of Science and Technology, Nanchang 330108, China.
Materials (Basel, Switzerland)
|February 13, 2026
Summary
This study demonstrates precise explosive welding (EXW) for fabricating reliable microelectronic and MEMS interfaces. Laser-controlled energetic materials enable controlled shockwaves for high-velocity metallic foil bonding, showing potential for advanced packaging solutions.
Area of Science:
- Materials Science
- Mechanical Engineering
- Surface Engineering
Background:
- Reliable interface fabrication is crucial for microelectronics and micro-electromechanical systems (MEMS) packaging.
- Traditional bonding methods face challenges in achieving high reliability for micro-scale components.
- Explosive welding (EXW) offers superior solid-state bonding characteristics for advanced materials.
Purpose of the Study:
- To investigate the precise explosive welding (EXW) of milligram-scale metallic foils using focused laser energy.
- To evaluate the technical feasibility and interfacial quality of laser-controlled EXW for Al/Cu bonding.
- To analyze the dynamic welding process and resulting interfacial microstructures.
Main Methods:
- Employing focused laser energy to control liquid energetic materials for precise EXW.
- Generating shockwaves for high-velocity oblique collisions between metallic foils and base plates.
- Conducting in situ observation, interfacial microstructure analysis, and numerical simulations for Al/Cu couples.
Main Results:
- Distinct Al/Cu elemental diffusion was observed at the bonding interface, confirming technical viability.
- The laser-controlled EXW approach demonstrated successful fabrication of Al/Cu bonding interfaces.
- An unloading rebound phenomenon was identified, characteristic of the dynamic impact process.
Conclusions:
- Laser-controlled explosive welding is a technically viable method for fabricating reliable Al/Cu bonding interfaces for microelectronics and MEMS.
- The study confirms the potential of precise EXW in advanced interface fabrication.
- Further optimization of impact loading control is needed to address the unloading rebound phenomenon for enhanced interface quality.
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