Fabrication of Highly Conductive Inkjet Printing Silver Nanoparticle Ink via a Synergistic Strategy Combining...

Inkjet printing technology shows significant potential for producing high-performance conductive circuits in printed electronics. However, conventional silver nanoparticle (Ag NP) inks often face challenges such as nozzle clogging, poor stability, and low conductivity after low-temperature sintering. While most existing studies focus solely on dispersant selection or individual process optimization, few have systematically explored the synergistic effects of particle size distribution, dispersion methods, and dispersant dosage. This study proposes a sequential optimization approach involving centrifugal classification to identify an optimal Ag NPs source and size distribution, followed by comparison and optimization of different dispersion methods. Furthermore, the effects of dispersant (a PEO-PPO-PEO triblock copolymer) concentration and application strategy (individual or combined use) on the rheological properties and conductivity of the ink were systematically investigated. The optimized Ag NP ink demonstrated excellent jetting stability with no nozzle clogging, exhibiting a surface tension of 19.60 mN/m and a viscosity of 6.83 mPa·s. After low-temperature sintering at 260 °C on glass or polyimide (PI) substrates, the printed patterns achieved a high electrical conductivity of 1.506 × 10⁷ S/m. Printing on polyethylene terephthalate (PET) at 150 °C confirmed compatibility with heat-sensitive flexible substrates. This work offers a comprehensive and practical strategy for developing highly reliable and conductive Ag NP inks, facilitating their application in next-generation printed electronics.