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A thermal resistance prediction model for heterogeneous integrated chips incorporating an AI-based BP neural network
Ying Li1, Shujun Xu2, Longjian Guo3
1Department of Electronics and Communication Engineering, Shandong College of Electronic Technology, Jinan, 250200, China. m18605311186@163.com.
Scientific Reports
|February 17, 2026
Abstract
No abstract available in PubMed .