Advances and Future Challenges in Monolithic 3D Integrated Logic, Power, and Optoelectronics Technologies for Tightly...

Area of Science:

• Materials Science
• Electrical Engineering
• Computer Engineering

Background:

• Artificial intelligence hardware demands high-performance heterogeneous integration.
• Maximizing computational capability requires high data bandwidth via advanced interconnects.
• Monolithic 3D (M3D) integration with 2D materials offers dense vertical stacking for logic and memory.

Purpose of the Study:

• To review the convergence of M3D integration, 2D materials, and photonic interconnects for next-generation computing.
• To highlight challenges in material compatibility, process scalability, and system-level codesign.
• To outline a unified framework for future computing and communication systems.

Main Methods:

• Review of current research in M3D integration and 2D materials.
• Analysis of photonic integrated circuits for low-latency, energy-efficient communication.
• Discussion of emerging concepts like tunable photodetectors and stacked transceivers.

Main Results:

• M3D integration enables compact vertical stacking with ultradense intertier vias.
• Photonic integrated circuits overcome electrical bandwidth limitations for longer communication distances.
• Emerging photonic concepts enhance scalability by reducing reliance on external lasers.

Conclusions:

• Addressing thermal management through electro-thermal analysis and codesign is critical for M3D architectures.
• The integration of M3D, 2D materials, and photonics presents a path beyond conventional silicon scaling.
• Overcoming material compatibility, scalability, and codesign challenges is essential for realizing next-generation systems.