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High-Throughput Large-Area Roll-to-Stamp-to-Plate Transfer Printing.

JeongHwan Yun1, Seungbeom Kim1, Jeyun Lee1

  • 1Department of Mechanical Engineering, Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of Korea.

ACS Applied Materials & Interfaces
|February 23, 2026
PubMed
Summary
This summary is machine-generated.

A novel roll-to-stamp-to-plate (R2S2P) system offers scalable, high-throughput transfer printing for micro/nanomaterials. This method achieves dynamic adhesion control for versatile applications in next-generation electronics and optoelectronics.

Keywords:
Roll-to-stamp-to-plateSpringbackSwitchabilityTransfer printingViscoelasticity

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Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Nanotechnology

Background:

  • Transfer printing is crucial for heterogeneous integration of micro/nanomaterials in advanced electronics.
  • Scaling transfer printing to large areas is challenging, limiting its widespread adoption.
  • Existing roller-based methods lack effective adhesion switching, restricting their use with diverse substrates.

Purpose of the Study:

  • To develop a high-throughput, large-area transfer printing system with enhanced adhesion switchability.
  • To overcome limitations of current roller-based methods for heterogeneous integration.
  • To enable versatile transfer printing across various substrates, including nonadhesive ones.

Main Methods:

  • Introduction of a roll-to-stamp-to-plate (R2S2P) system with a multilayer configuration.
  • Dynamic adhesion control achieved through springback-driven detachment and reversible microstructure collapse.
  • Optimization of microstructured stamp design using mechanical experiments and finite element analysis.

Main Results:

  • The R2S2P system demonstrates high adhesion switchability for diverse substrate applications.
  • Optimized stamp design balances strong pick-up adhesion with gentle release.
  • High-speed imaging confirmed the importance of detachment dynamics for successful printing.
  • Achieved a rapid retrieval rate of 0.34 s/cm² over a 1 cm² area.

Conclusions:

  • The R2S2P platform provides a scalable and versatile solution for large-area heterogeneous integration.
  • Demonstrated successful transfer of diverse Si platelet arrays and unconventional materials onto nonadhesive substrates.
  • Paves the way for advanced applications in optoelectronics, large-area sensors, and integrated devices.