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ULTCC-Compatible LiPO3 Ceramic with Ultralow Permittivity for 5G High-Gain Antenna Array Applications
Jian Bao1, Jing Guo1, Tao Zhou2
1Electronic Materials Research Laboratory and Multifunctional Materials and Structures, Key Laboratory of the Ministry of Education and International Center for Dielectric Research, School of Electronic Science and Engineering, Xi'an Jiaotong University, Xi'an 710049, Shaanxi, China.
ACS Applied Materials & Interfaces
|February 26, 2026
Summary
This study introduces LiPO3 ceramic substrates for radio frequency (RF) systems, offering low permittivity and high thermal conductivity. This ceramic enhances RF component lifespan and performance, addressing critical thermal management challenges.
Area of Science:
- Materials Science
- Ceramic Engineering
- Radio Frequency (RF) Engineering
Background:
- Organic substrates in RF systems have low permittivity but poor thermal conductivity, causing thermal management issues.
- Existing materials struggle to balance low signal delay and effective heat dissipation in high-integration RF applications.
Purpose of the Study:
- To propose and evaluate LiPO3 ceramic as a novel substrate material for advanced RF systems.
- To address the limitations of organic substrates by improving thermal conductivity while maintaining low permittivity.
Main Methods:
- Characterization of LiPO3 ceramic's dielectric properties (permittivity, quality factor) and thermal conductivity.
- Evaluation of its sintering behavior and compatibility with aluminum.
- Application testing in a 5G antenna array.
Main Results:
- LiPO3 exhibits ultralow permittivity (εr ≈ 4) and high quality factors (tanδ ~ 10⁻⁴).
- Thermal conductivity of LiPO3 exceeds 2 W/(m·K), significantly higher than organic substrates.
- Low sintering temperature (630 °C) and excellent compatibility with aluminum for ultralow temperature cofired ceramics (ULTCC).
Conclusions:
- LiPO3 ceramic is a promising material for RF systems, resolving the conflict between signal delay and thermal management.
- Its properties enable longer RF component lifespans and improved performance in high-frequency applications like 5G.
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