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Related Concept Videos

Thermal expansion and Thermal stress: Problem Solving01:27

Thermal expansion and Thermal stress: Problem Solving

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San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in temperature (ΔT) is 55...
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Thermal Stress01:09

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If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...
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Mechanism of heat transfer01:19

Mechanism of heat transfer

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Understanding heat transfer mechanisms is essential for understanding how our bodies maintain balance in different environmental conditions. When the environment is thermoneutral, the body is in a state of balance, neither using nor releasing energy to maintain its core temperature. However, when the environment is not thermoneutral, the body employs four heat transfer mechanisms to maintain homeostasis: conduction, convection, evaporation, and radiation. These mechanisms facilitate heat...
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Mechanisms of Heat Transfer II01:20

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In convection, thermal energy is carried by the large-scale flow of matter. Ocean currents and large-scale atmospheric circulation, which result from the buoyancy of warm air and water, transfer hot air from the tropics toward the poles and cold air from the poles toward the tropics. The Earth’s rotation interacts with those flows, causing the observed eastward flow of air in the temperate zones. Convection dominates heat transfer by air, and the amount of available space for the airflow...
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Mechanisms of Heat Transfer I01:14

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Just as interesting as the effects of heat transfer on a system are the methods by which the heat transfer occur. Whenever there is a temperature difference, heat transfer occurs. It may occur rapidly, such as through a cooking pan, or slowly, such as through the walls of a picnic ice box. So many processes involve heat transfer that it is hard to imagine a situation where no heat transfer occurs. Yet, every heat transfer takes place by only three methods: conduction, convection, and radiation.
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Thermal strain is a concept that arises when we consider how temperature changes affect structures. Unlike the conventional assumption that structures remain constant under load, real-world scenarios often involve temperature fluctuations that can significantly impact these structures. Consider a homogeneous rod with a uniform cross-section resting freely on a flat horizontal surface. If the rod's temperature increases, the rod elongates. This elongation is proportional to the temperature...
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Related Experiment Video

Updated: Feb 28, 2026

Microfluidic Chips Controlled with Elastomeric Microvalve Arrays
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Research on Intelligent Thermal Optimization for Chiplet-Based Heterogeneously Integrated AI Chip Embedded with

Jie Wu1, Yu Liang1, Guibin Liu1

  • 1College of Integrated Circuit Science and Engineering (College of Industry-Education Integration), Nanjing University of Posts and Telecommunications, Nanjing 210003, China.

Materials (Basel, Switzerland)
|February 27, 2026
PubMed
Summary

Advanced AI chips face hotspots due to inadequate cooling. A novel leaf-vein fractal microchannel design significantly reduces AI chip junction temperature by 76%, offering effective hotspot mitigation.

Keywords:
fractal microchannelheat dissipationheterogeneous integrationmachine learningmulti-parameter optimization

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Area of Science:

  • Thermal Management
  • Microfluidics
  • Artificial Intelligence Hardware

Background:

  • High-performance AI chips with heterogeneous integration generate non-uniform heat.
  • Conventional cooling struggles with dynamic thermal maps, leading to hotspots.
  • Chiplet-based designs exacerbate thermal challenges.

Purpose of the Study:

  • To develop an adaptive cooling solution for AI processors.
  • To mitigate thermal hotspots in heterogeneous AI packages.
  • To investigate a fractal microchannel design inspired by leaf veins.

Main Methods:

  • Finite Element Method (FEM)-based orthogonal experiments were conducted.
  • Analysis of Variance (ANOVA) and range analysis ranked parameter influence.
  • A machine-learned surrogate model coupled with Particle Swarm Optimization (PSO) was used for optimization.

Main Results:

  • The fractal microchannel demonstrated ultra-low thermal resistance and high heat-transfer coefficients.
  • Optimal parameter selection significantly reduced AI chip junction temperature.
  • A 76% improvement in cooling efficiency was achieved, lowering temperature from 127.80 °C to 30.97 °C.

Conclusions:

  • The leaf-vein-inspired fractal microchannel effectively addresses thermal hotspots in AI chips.
  • This design offers a scalable and efficient solution for advanced heterogeneous AI packages.
  • Provides a theoretical foundation for next-generation AI hardware thermal management.