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Elastoplastic Analysis of Plane Stress Problems for Porous Plastic Material
Jiaxing Zeng1, Jianxiong Liu1, Tiansu Li2
1Faculty of Mechanical and Electrical Engineering, Kunming University of Science and Technology, Kunming 650500, China.
This study introduces a mesoscale damage model to analyze how void damage affects material properties. Increased void volume fraction reduces radial stress and displacement, impacting material flow and yield behavior.
Area of Science:
- Materials Science
- Solid Mechanics
- Continuum Damage Mechanics
Background:
- Void damage significantly impacts material mechanical properties.
- Existing models require refinement to accurately capture mesoscale damage effects.
- Understanding void evolution is crucial for predicting material failure.
Purpose of the Study:
- To develop a mesoscale damage model incorporating void volume fraction into the macroscopic yield function.
- To establish the constitutive relationship and perform elastoplastic analysis for axisymmetric plane stress problems.
- To investigate the influence of void volume fraction on stress and displacement fields.
Main Methods:
- Utilizing a two-parameter yield criterion, associated flow rule, and upper bound theorem.
- Introducing void volume fraction into the macroscopic yield function to create a mesoscale damage model.
- Establishing constitutive relationships and performing elastoplastic analysis using derived differential equations.
Main Results:
- The yield surface is presented for various void volume fractions and Poisson's ratios.
- Numerical solutions reveal that proximity to void opening increases radial stress and displacement.
- Higher void volume fractions lead to decreased radial stress and displacement, with minimal change in circumferential stress.
Conclusions:
- The developed mesoscale damage model effectively predicts material behavior under void damage.
- Void volume fraction is a critical parameter influencing stress distribution and material flow.
- The model provides insights into how material yields and deforms in the presence of voids.
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